Blade SBI-421E-1T3N

Note: Complete system should include at least
1 CPU, 1 DIMM, & 1 HDD/SSD.

Key Applications

Enterprise data center
EDA, Cloud
High-performance Computing (HPC)

Key features

1. 100 servers per 42U Rack

2. Dual socket E (LGA-4677) supports 5th/4th Gen Intel® Xeon® Scalable processors

3. Intel® C741 chipset

4. 16 DDR5 DIMM slots, 1DPC with 5600MHz ECC RDIMM

5. Support up to 8 drives per blade

6. Dual-port 25G Ethernet (LOM), additional 200G/100G InfiniBand or dual-port 25G Ethernet via mezzanine card

7. OCP 3.0 network card support, e.g. 400G NDR InfiniBand card*

8. Liquid cooling solution is available*

* Please contact your Tech Standard Solutions sales rep for more info.

Specifications


Product SKUs

SuperBlade Sled	SBI-421E-1T3N
Motherboard	MBD-B13DET


Processor

CPU	Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Intel® Xeon® CPU Max Series with High Bandwidth Memory (HBM)
Note	Up to 205W TDP CPUs (Air Cooling at 35°C) Certain CPUs with higher TDP may be supported under specific conditions. Please refer to Thermal Matrix. Up to 350W TDP CPUs (Direct Liquid Cooling)


System Memory

Memory Capacity	16 DDR5 DIMM slots 1DPC with 5600MHz ECC RDIMM


On-Board Devices

Chipset	Intel® C741 chipset
Network Controllers	Onboard Dual 25G Ethernet 1 Mezzanine expansion slot and 3 different optional Mezzanine card. 1 OCP 3.0 network card (option) Optional: Dual 25G Ethernet / 100G EDR / 200G HDR / 400G NDR*
MGMT/Security	IPMI 2.0 / KVM over IP / Redfish API/TPM 2.0/Signed Firmware/HW Root of Trust
Graphics	Aspeed AST2600


System BIOS

BIOS Type	256Mb SPI Flash EEPROM with AMI® BIOS
BIOS Features	Plug and Play (PnP) PCI 2.2 ACPI up to 3.0 USB Keyboard support


Dimensions

Height	1.75"
Width	6.5"
Depth	23.5"
Weight	9.5 lbs (4.3 kg)
Available Colors	Black


Front Panel

Buttons	Power On/Off button
LEDs	Power LED UID Network Activity LED Fault LED


Drive Bays

Hot-swap	2 Hot-swap U.2 NVMe/SATA3 drive bays 1 Hot-swap SATA3 drive bay
M.2	1 M.2 2280 Optional: 4 M.2 NVMe via mezz card


Input / Output

TPM	1 TPM 2.0 Header


Operating Environment

RoHS	RoHS Compliant
Environmental Spec.	Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)

Parts List


Optional Parts List

	Part Number	Qty	Description
TPM security module (optional, not included)	AOM-TPM-9670V AOM-TPM-9671V	-	TPM module (Vertical) TPM 2.0 TPM module (Vertical) TPM 1.2.
VROC	AOC-VROCPREMOD AOC-VROCSTNMOD	-	Intel VROC Premium, RAID 0, 1, 5, 10 Intel VROC HW key (RSTe) standard upgrade module
Heatsink / Retention	SNK-P1046VM	-	Heatsink for Front CPU
Heatsink / Retention	SNK-P1046V	-	Heatsink for Rear CPU
Liquid Cooling Module (OEM only)	SNK-P3053	-	Liquid cooling cold plate (Supermicro)
Liquid Cooling Module (OEM only)	SNK-P3044	-	Liquid cooling cold plate (3rd party vendor)
Bracket for Liquid Cooling	MCP-620-41030-0N	-	8U Superblade bracket for liquid cooling
CPU Carrier	SKT-1333L-0000-FXC SKT-1333L-0001-LTS SKT-1424L-001B-FXC SKT-1424L-001B-LTS SKT-1425H-001C-FXC SKT-1425H-001C-LTS	-	Socket E LGA4677, E1A, XCC, DG 0.7 Socket E LGA4677, E1A, XCC, DG1.0, NO SHIM, BLK HSG Socket E E1B LGA 4677 W/SHIM SP MCC, DG0.95 Socket E E1B LAG 4677 W/SHIM SPR MCC, DG1.0 Socket E E1C LGA 4677 W/O SHIM SPR+HBM, DG0.7 Socket E E1C LGA 4677 W/O SHIM SPR+HBM, DG0.7
SuperBlade Tray	MCP-630-41004-0N	-	4U 10 SuperBlade Tray Extended Top cover for Double-Width
Networking	AOC-B25G-X4D-B	-	SuperBlade 2-port 25GbE Mezzanine Card
Networking	AOC-IBH-X4ES-B	-	Mezzanine Card for InfiniBand EDR Single Port with mounting bracket
Networking	AOC-IBH-X6HS-B	-	SuperBlade InfiniBand HDR one port Mezzanine card with mounting bracket
Software	SFT-DCMS-Single	-	DataCenter Management Package (per node license)
Add-on Card / Module	AOM-B-4M	-	4 x M.2 NVMe mezzanine card, 4x 110(80)

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