GPU ARS-111GL-NHR-LCC

NVIDIA GH200 Grace Hopper Superchip system with liquid-cooling supporting NVIDIA BlueField-3 or NVIDIA ConnectX-7

Key Applications

High Performance Computing
Large Language Model (LLM) and Generative AI
AI / Deep Learning Training and Inference

Key features

This system currently supports two E1.S drives direct to the processor and the onboard GPU only. Please consult your Tech Standard Solutions Salesperson for details.

High density 1U GPU system with Integrated NVIDIA® H100 GPU and liquid cooling
NVIDIA Grace Hopper™ Superchip (Grace CPU and H100 GPU)
NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and GPU at 900GB/s
Up to 576GB of coherent memory per node including 480GB LPDDR5X and 96GB of HBM3 for LLM applications
2x PCIe 5.0 x16 slots supporting NVIDIA BlueField®-3 or ConnectX®-7
7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
This system supports two E1.S drives directly from the processor only.

Specifications

Product SKUs
ARS-111GL-NHR-LCC

Motherboard
Super G1SMH-G

Processor
CPU	NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip
Note	Supports up to 1000W TDP CPUs (Liquid Cooled)

GPU
Max GPU Count	Up to 1 onboard GPU(s)
Supported GPU	NVIDIA: H100 Tensor Core GPU on GH200 Grace Hopper™ Superchip (Liquid-cooled) View GPU Options
CPU-GPU Interconnect	NVLink®-C2C

System Memory
Memory	Slot Count: Onboard Memory Max Memory: Up to 480GB ECC LPDDR5X Additional GPU Memory: Up to 96GB ECC HBM3

On-Board Devices
Chipset	System on Chip
Network Connectivity	View AOC Options

Input / Output
LAN	1 RJ45 1 GbE Dedicated IPMI LAN port(s)
Video	1 mini-DP port(s)

System BIOS
BIOS Type	AMI 64MB SPI Flash EEPROM

Management
Power configurations	Power-on mode for AC power recovery ACPI Power Management

PC Health Monitoring
CPU	Monitors for CPU Cores, Chipset Voltages, Memory
FAN	Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature	Monitoring for CPU and chassis environment Thermal Control for fan connectors

Chassis
Form Factor	1U Rackmount
Model	CSE-GP102TS-R000NDFP

Dimensions and Weight
Height	1.75" (44 mm)
Width	17.33" (440 mm)
Depth	37" (940 mm)
Package	9.5" (H) x 48" (W) x 28" (D)
Weight	Gross Weight: 65.5 lbs (29.7 kg) Net Weight: 48.5 lbs (22 kg)
Available Color	Silver

Expansion Slots
PCI-Express (PCIe) Configuration	Default 2 PCIe 5.0 x16 FHFL slot(s) View AOC Options

Drive Bays / Storage
Drive Bays Configuration	Default: Total 8 bay(s) 8 front hot-swap E1.S NVMe drive bay(s)
M.2	2 M.2 NVMe slot(s) (M-key)

System Cooling
Fans	9 Removable heavy-duty 4cm Fan(s)
Liquid Cooling	Direct to Chip (D2C) Cold Plate (optional)

Power Supply

2x 2000W Redundant Titanium Level (96%) power supplies

Dimension (WxHxL)	73.5 x 40 x 185 mm
AC Input	1000W: 100-127Vac / 50-60Hz 1800W: 200-220Vac / 50-60Hz 1980W: 220-230Vac / 50-60Hz 2000W: 220-240Vac / 50-60Hz (for UL only) 2000W: 230-240Vac / 50-60Hz 2000W: 230-240Vdc / 50-60Hz (for CQC only)
+12V	Max: 83A / Min: 0A (100Vac-127Vac) Max: 150A / Min: 0A (200Vac-220Vac) Max: 165A / Min: 0A (220Vac-230Vac) Max: 166A / Min: 0A (230Vac-240Vac)
12V SB	Max: 3.5A / Min: 0A
Output Type	Backplanes (gold finger)

Operating Environment
Environmental Spec.	Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)

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